Solvent-free, fillable epoxy resin bonding agent for PANDOMO substrate preparation
- Versatile in use
- High mechanical load capacity
- Solvent-free
- Good adhesion to various substrates
- Paste-like consistency with high penetrating power, suitable for filling
- Very low emission EC1 PLUS R
Solvent-free, fillable epoxy resin bonding agent for PANDOMO substrate preparation
- Versatile in use
- High mechanical load capacity
- Solvent-free
- Good adhesion to various substrates
- Paste-like consistency with high penetrating power, suitable for filling
- Very low emission EC1 PLUS R
Solvent-free, fillable epoxy resin bonding agent for PANDOMO substrate preparation
- Versatile in use
- High mechanical load capacity
- Solvent-free
- Good adhesion to various substrates
- Paste-like consistency with high penetrating power, suitable for filling
- Very low emission EC1 PLUS R